Arctic Liquid Freezer III 280mm ARGB White CPU Liquid Cooler

Arctic Liquid Freezer III 280mm ARGB White CPU Liquid Cooler

Feature

• LGA1851 AND LGA1700 CONTACT FRAME: Improved contact pressure distribution through Intel mounting frame for efficient heat transfer, thanks to even CPU contact surface
• NATIVE AMD OFFSET MOUNTING: Optimized for the multi-die chiplet design of Ryzen processors – 5mm offset for optimal coverage of the CPU hotspot, resulting in more efficient heat transfer
• ACTIVE COOLING OF THE VOLTAGE CONVERTERS: PWM-controlled VRM fan that additionally cools components in the base area, such as voltage converters
• INTEGRATED CABLE MANAGEMENT: The PWM cables of the radiator fans are integrated into the jacket of the hoses, which means that only one visible cable is connected to the motherboard
• LIMITED COMPATIBILITY WITH A FEW MOTHERBOARDS: Oversized coolers on the M.2_1 slot can lead to compatibility problems. An overview and solution is available in the technical data, in the manual and on the manufacturer’s website. Please use the compatibility check

Liquid Freezer III 280 A-RGB (White)

Multi Compatible All-in-One CPU Water Cooler with A-RGB

Ready Out-of-the-Box – Easy Installation

The Liquid Freezer III is ready for immediate use thanks to its pre-installed radiator fans in push configuration. The fan cables are integrated into the jacket of the hoses so that only one cable needs to be connected to the motherboard. With the MX-6 thermal compound included in delivery, you have everything you need for quick and easy installation.

Liquid Freezer III 280 A-RGB – Tested and Confirmed by Intel

Intel has tested and confirmed the Liquid Freezer III on the i9-13900K/KF, i9-14900K/KF and i9-13900KS in the Enthusiast and Desktop category. In these tests, Intel considered both the mounting with contact frame and the cooler’s performance.

Future-Proof Compatibility

The Liquid Freezer III is multi-compatible with Intel and AMD sockets. Intel will release the new Arrow Lake processors on the LGA1851 socket in the future. We guarantee full compatibility. All Liquid Freezer III can be used with the new LGA1851 socket from Intel without limitation.

Contact Frame for Intel LGA1700 and LGA1851

Intel’s Independent Loading Mechanism (ILM) deforms the CPU by pressing it into the socket at two points with over 40 kg. This causes pressure in the PCB, the die and the solder layer between the die and IHS (Integrated Heat Spreader). With high thermal load, this can lead to long-term problems. The mounting frame from ARCTIC does not deform the CPU, reduces the mechanical load on the CPU massively, is quick and easy to install and allows the cooler to be screwed onto the CPU’s backplate. As a result, mechanical stress on the mainboard and CPU is minimised, cooling performance remains consistent and installation is quick and uncomplicated.

Silent and Powerful VRM Fan

The voltage converters of motherboards often work at their maximum temperature in combination with power-hungry CPUs. To compensate the lack of airflow from a tower cooler, the Liquid Freezer III works with a revised VRM fan. The 60 mm PWM-controlled fan enables almost silent cooling of the socket area when VRM cooling is insufficient, in cases with poor airflow or especially in overclocking scenarios. This enables a continuously higher load and a longer service life for the voltage converters.

Integrated Cable Management

The fan cables are hidden within the sleeving. With the Liquid Freezer III, only the connectors from the pump head need to be connected to the motherboard—no additional cable routing required. No extra splitter cables are needed, which simplifies installation and improves the overall look.

Native AMD Offset Mounting

For several generations, AMD has been using a multi-die chiplet design for its Ryzen desktop processors. Unlike Intel CPUs, the hotspot on these processors is not located centrally under the IHS (Integrated Heat Spreader), but is slightly offset. The AMD mounting solution therefore has a 5 mm offset in order to achieve optimum heat dissipation.